1/6 emif03-sim01 ? july 2003 - ed: 8a iec61000-4-2 15kv (air discharge) 8 kv (contact discharge) mil std 883e - method 3015-6 class 3 complies with the following standards : flip chip package b c 1 2 3 a rst in rst out clt in data in gnd v cc clt out data out pin configuration (ball side) emi symmetrical (i/o) low-pass-filter high efficiency in emi filtering very low pcb space consuming: 1.57mm x 1.57 mm very thin package: 0.65 mm high efficiency in esd suppression high reliability offered by monolithic integration high reducing of parasitic elements through inte- gration & wafer level packaging. benefits 3 lines emi filter and esd protection ipad tm emi filtering and esd protection for : sim interface (subscriber identify module) uim interface (universal identify module) main product applications the emif03-sim01 is a highly integrated devices designed to suppress emi/rfi noise in all systems subjected to electromagnetic interferences. the emif03 flip chip packaging means the package size is equal to the die size. this filter includes an esd protection circuitry which prevents the device from destruction when subjected to esd surges up 15kv. description tm : ipad is a trademark of stmicroelectronics. 47 ? clk in data in clk out data out 100 ? r1 r2 r3 rst in rst out 100 ? v cc gnd configuration
emif03-sim01 2/6 symbol parameter and test conditions value unit t j maximum junction temperature 125 c t op operating temperature range -40 to + 85 c t stg storage temperature range -55 to +150 c absolute ratings (limiting values) symbol test conditions min. typ. max. unit v br i r =1ma 6v i rm v rm =3v 1 a r d 1.5 ? r 1 95 100 105 ? r 2 44.65 47 49.35 ? r 3 95 100 105 ? c line @0v 35 pf i v i f i rm i r i pp v rm v f v br v cl symbol parameter v br breakdown voltage i rm leakage current @ v rm v rm stand-off voltage v cl clamping voltage rd dynamic impedance i pp peak pulse current r i/o series resistance between input & output cline input capacitance per line electrical characteristics (t amb = 25 c) aplac 7.60 user: stmicroelectronics feb 22 2001 100.0k 1.0m 10.0m 100.0m 1.0g -50.00 -45.00 -40.00 -35.00 -30.00 -25.00 -20.00 -15.00 -10.00 -5.00 0.00 db f/hz b3_b1(clk) a3_a2(rst) c3_c1(dat) fig. 1: s21 (db) attenuation measurements. db mhz fig. 2: analog crosstalk measurements.
emif03-sim01 3/6 fig. 4: esd response to iec61000-4-2 (+15kv air discharge) on one input and on one output. fig. 3: digital crosstalk measurements . 10 15 20 25 30 35 0123456 f=1mhz vosc=30mv tj=25c c(pf) vr(v) fig. 6: line capacitance versus reverse applied voltage. fig. 5: esd response to iec61000-4-2 (-15kv air discharge) on one input and on one output.
emif03-sim01 4/6 sub 50p 0.05 0.08nh 0.1 demif03 diodes model - rs = 1.2 - cjo = 17p - m = 0.3333 - vj = 0.6 - isr = 100p - bv = 6.8 - ibv = 1m - tt = 100n rseries = 47r (clk line) = 100r (rst & data lines) demif03_vcc diode model - rs = 1.5 - cjo = 20p - m = 0.3333 - vj = 0.6 - isr = 100p - bv = 6.8 - ibv = 1m - tt = 100n rseries sub port1 50 port2 50 model = demif03 model = demif03 model = demif03_vcc sub vcc aplac model emif yy f x - xxx zz emi filter number of lines x: resistance value (ohms) z: capacitance value / 10(pf) or application (3 letters) and version (2 digits) flip chip 1: pitch = 500m, bump = 315m 2: leadfree pitch = 500m bump = 315m 3: leadfree pitch = 400m bump = 250m 4: pitch = 500m, bump = 250m order code 1.57mm 50m 1.57mm 50m 315m 50 500m 50 500m 50 650m 65 package mechanical data (all dimensions in m)
emif03-sim01 5/6 365 365 240 40 220 x y x w x w dot, st logo xxx = marking yww = datecode (y = year ww = week) all dimensions in m marking copper pad diameter : 250m recommended , 300m max solder stencil opening : 330m solder mask opening recommendation : 340m min for 315m copper pad diameter foot print recommendations
emif03-sim01 6/6 information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap - proval of stmicroelectronics. the st logo is a registered trademark of stmicroelectronics ? 2003 stmicroelectronics - printed in italy - all rights reserved. stmicroelectronics group of companies australia - brazil - canada - china - finland - france - germany hong kong - india - israel - italy - japan - malaysia - malta - morocco - singapore spain - sweden - switzerland - united kingdom - united states. http://www.st.com ordering code marking package weight base qty delivery mode emif03-sim01 fct flip chip 3.3 mg 5000 tape & reel 7? packing note: more packing information are available in the application note an1235: ?flip-chip: package description and recommendations for use? dot identifying pin a1 location user direction of unreeling all dimensions in mm 4 +/- 0.1 8 +/- 0.3 4 +/- 0.1 1.75 +/- 0.1 3.5 +/- 0.1 ? 1.5 +/- 0.1 0.73 +/- 0.05 st xxx yww st xxx yww st xxx yww packing
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